Solution Architecture
Technical Stack Proposal¶
We MUST define why these ingredients are desirable to our recipe.
Identify the technologies associated with each layer of the ToIP Stack that will help to define this TIP.
| ToIP Technical Stack Layer | TIP Technology |
|---|---|
| Three | Hyperledger Aries |
| Two | Hyperledger Aries with DIDComm |
| One | Hyperledger Indy |
The vendors supporting this TIP have agreed to support the following solution components:
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Layer 1: Public Identity Utilities that implement the Indy DID Method Specification.
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Layer 2: Digital Wallet and Agent software that leverages the DIDComm plug-in in Hyperledger Aires which is compliant with ToIP TSS0011: Layer 1 Interop Spec.
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Layer 3: Digital Wallet and Agent software that leverages the Hyperledger Aires which is compliant with ToIP TSS0012: Layer 2 Interop Spec.